Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Aniket PATIL, Brigham NAVAJA, Hong Bok We | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Aniket PATIL, Brigham NAVAJA, Hong Bok We | 2023-02-14 |