Issued Patents 2023
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832391 | Terminal connection routing and method the same | Hong Bok We, Joan Rey Villarba BUOT | 2023-11-28 |
| 11817365 | Thermal mitigation die using back side etch | Hong Bok We, Jonghae Kim | 2023-11-14 |
| 11804645 | Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT | 2023-10-31 |
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT, Michelle Yejin Kim, Kuiwon Kang | 2023-10-17 |
| 11791276 | Package comprising passive component between substrates for improved power distribution network (PDN) performance | Hong Bok We, Joan Rey Villarba BUOT | 2023-10-17 |
| 11784151 | Redistribution layer connection | Hong Bok We, Marcus HSU | 2023-10-10 |
| 11769732 | Integrated circuit (IC) with reconstituted die interposer for improved connectivity, and related methods of fabrication | Jonghae Kim | 2023-09-26 |
| 11749611 | Package with a substrate comprising periphery interconnects | Hong Bok We | 2023-09-05 |
| 11749579 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Hong Bok We, Bohan Yan | 2023-09-05 |
| 11715688 | Variable dielectric constant materials in same layer of a package | Hong Bok We | 2023-08-01 |
| 11682607 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate | Hong Bok We, Marcus HSU | 2023-06-20 |
| 11658391 | Antenna module | Hong Bok We, Jeahyeong Han, Mohammad Ali Tassoudji | 2023-05-23 |
| 11637057 | Uniform via pad structure having covered traces between partially covered pads | Kuiwon Kang, Chin-Kwan Kim, Jaehyun Yeon | 2023-04-25 |
| 11605595 | Packages with local high-density routing region embedded within an insulating layer | Hong Bok We, Kuiwon Kang | 2023-03-14 |
| 11581251 | Package comprising inter-substrate gradient interconnect structure | Zhijie Wang, Joan Rey Villarba BUOT, Hong Bok We | 2023-02-14 |
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Brigham NAVAJA, Hong Bok We, Yuzhe ZHANG | 2023-02-14 |
| 11562962 | Package comprising a substrate and interconnect device configured for diagonal routing | Joan Rey Villarba BUOT, Zhijie Wang, Hong Bok We | 2023-01-24 |
| D975665 | Susceptor shaft | Sam Kim | 2023-01-17 |
| 11552015 | Substrate comprising a high-density interconnect portion embedded in a core layer | Hong Bok We, Kuiwon Kang | 2023-01-10 |
| 11545439 | Package comprising an integrated device coupled to a substrate through a cavity | Hong Bok We, Kuiwon Kang | 2023-01-03 |