Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832391 | Terminal connection routing and method the same | Aniket PATIL, Hong Bok We | 2023-11-28 |
| 11804645 | Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods | Hong Bok We, Aniket PATIL | 2023-10-31 |
| 11791276 | Package comprising passive component between substrates for improved power distribution network (PDN) performance | Aniket PATIL, Hong Bok We | 2023-10-17 |
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Michelle Yejin Kim, Kuiwon Kang, Aniket PATIL | 2023-10-17 |
| 11764076 | Semi-embedded trace structure with partially buried traces | Kuiwon Kang, Terence Cheung | 2023-09-19 |
| 11676905 | Integrated circuit (IC) package with stacked die wire bond connections, and related methods | Kuiwon Kang, Michelle Yejin Kim, Jialing Tong | 2023-06-13 |
| 11581251 | Package comprising inter-substrate gradient interconnect structure | Aniket PATIL, Zhijie Wang, Hong Bok We | 2023-02-14 |
| 11562962 | Package comprising a substrate and interconnect device configured for diagonal routing | Aniket PATIL, Zhijie Wang, Hong Bok We | 2023-01-24 |