Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT, Kuiwon Kang, Aniket PATIL | 2023-10-17 |
| 11676905 | Integrated circuit (IC) package with stacked die wire bond connections, and related methods | Kuiwon Kang, Joan Rey Villarba BUOT, Jialing Tong | 2023-06-13 |