Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT, Michelle Yejin Kim, Aniket PATIL | 2023-10-17 |
| 11776888 | Package with a substrate comprising protruding pad interconnects | Hong Bok We, Chin-Kwan Kim, Milind Shah | 2023-10-03 |
| 11764076 | Semi-embedded trace structure with partially buried traces | Joan Rey Villarba BUOT, Terence Cheung | 2023-09-19 |
| 11676905 | Integrated circuit (IC) package with stacked die wire bond connections, and related methods | Michelle Yejin Kim, Joan Rey Villarba BUOT, Jialing Tong | 2023-06-13 |
| 11637057 | Uniform via pad structure having covered traces between partially covered pads | Chin-Kwan Kim, Aniket PATIL, Jaehyun Yeon | 2023-04-25 |
| 11605595 | Packages with local high-density routing region embedded within an insulating layer | Aniket PATIL, Hong Bok We | 2023-03-14 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Brigham NAVAJA, Marcus HSU, Terence Cheung | 2023-01-10 |
| 11552015 | Substrate comprising a high-density interconnect portion embedded in a core layer | Aniket PATIL, Hong Bok We | 2023-01-10 |
| 11545435 | Double sided embedded trace substrate | Zhijie Wang, Hong Bok We | 2023-01-03 |
| 11545439 | Package comprising an integrated device coupled to a substrate through a cavity | Aniket PATIL, Hong Bok We | 2023-01-03 |