Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776888 | Package with a substrate comprising protruding pad interconnects | Kuiwon Kang, Hong Bok We, Milind Shah | 2023-10-03 |
| 11764489 | Sub-module L-shaped millimeter wave antenna-in-package | Milind Shah, Jaehyun Yeon, Rajneesh Kumar, Suhyung Hwang | 2023-09-19 |
| 11756894 | Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods | Jeahyeong Han, Rajneesh Kumar, Jeongil Jay Kim | 2023-09-12 |
| 11637057 | Uniform via pad structure having covered traces between partially covered pads | Kuiwon Kang, Aniket PATIL, Jaehyun Yeon | 2023-04-25 |