Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823983 | Package with a substrate comprising pad-on-pad interconnects | Kun Fang, Suhyung Hwang, Hong Bok We | 2023-11-21 |
| 11764489 | Sub-module L-shaped millimeter wave antenna-in-package | Milind Shah, Chin-Kwan Kim, Rajneesh Kumar, Suhyung Hwang | 2023-09-19 |
| 11735804 | Multi-core broadband PCB antenna | Chaoqi Zhang, Suhyung Hwang, Taesik Yang, Jeongil Jay Kim, Darryl Sheldon JESSIE +1 more | 2023-08-22 |
| 11637057 | Uniform via pad structure having covered traces between partially covered pads | Kuiwon Kang, Chin-Kwan Kim, Aniket PATIL | 2023-04-25 |
| 11551939 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Suhyung Hwang, Hong Bok We | 2023-01-10 |
| 11545425 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Suhyung Hwang, Hong Bok We | 2023-01-03 |