Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823983 | Package with a substrate comprising pad-on-pad interconnects | Kun Fang, Jaehyun Yeon, Hong Bok We | 2023-11-21 |
| 11764489 | Sub-module L-shaped millimeter wave antenna-in-package | Milind Shah, Chin-Kwan Kim, Jaehyun Yeon, Rajneesh Kumar | 2023-09-19 |
| 11735804 | Multi-core broadband PCB antenna | Chaoqi Zhang, Jaehyun Yeon, Taesik Yang, Jeongil Jay Kim, Darryl Sheldon JESSIE +1 more | 2023-08-22 |
| 11696390 | Systems for shielding bent signal lines | Jeahyeong Han, Mina Iskander, Rajneesh Kumar, Darryl Sheldon JESSIE | 2023-07-04 |
| 11551939 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Jaehyun Yeon, Hong Bok We | 2023-01-10 |
| 11545425 | Substrate comprising interconnects embedded in a solder resist layer | Kun Fang, Jaehyun Yeon, Hong Bok We | 2023-01-03 |