Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817379 | Substrate comprising an inductor and a capacitor located in an encapsulation layer | Jonghae Kim, Periannan Chidambaram | 2023-11-14 |
| 11776888 | Package with a substrate comprising protruding pad interconnects | Kuiwon Kang, Hong Bok We, Chin-Kwan Kim | 2023-10-03 |
| 11764489 | Sub-module L-shaped millimeter wave antenna-in-package | Chin-Kwan Kim, Jaehyun Yeon, Rajneesh Kumar, Suhyung Hwang | 2023-09-19 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Jonghae Kim, Je-Hsiung Lan, Ranadeep Dutta, Periannan Chidambaram | 2023-06-27 |
| 11670614 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Periannan Chidambaram, Abdolreza Langari | 2023-06-06 |
| 11652101 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Periannan Chidambaram | 2023-05-16 |