Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817379 | Substrate comprising an inductor and a capacitor located in an encapsulation layer | Jonghae Kim, Milind Shah | 2023-11-14 |
| 11687766 | Artificial neural networks with precision weight for artificial intelligence | Haining Yang | 2023-06-27 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Jonghae Kim, Je-Hsiung Lan, Ranadeep Dutta, Milind Shah | 2023-06-27 |
| 11670614 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Milind Shah, Abdolreza Langari | 2023-06-06 |
| 11652101 | Trench capacitor assembly for high capacitance density | Jonghae Kim, Milind Shah | 2023-05-16 |
| 11631614 | MIM capacitor with adjustable capacitance via electronic fuses | Jonghae Kim, Jin-Su Ko, Beomsup Kim | 2023-04-18 |