Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670614 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Milind Shah, Periannan Chidambaram | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670614 | Integrated circuit assembly with hybrid bonding | Jonghae Kim, Milind Shah, Periannan Chidambaram | 2023-06-06 |