Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749579 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Aniket PATIL, Hong Bok We | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749579 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Aniket PATIL, Hong Bok We | 2023-09-05 |