Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Charles David Paynter, Ryan David Lane, Jianwen Xu, William Stone | 2023-10-10 |
| 11676922 | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer | Yue Li, Yangyang SUN | 2023-06-13 |
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Ryan David Lane, Charles David Paynter, Eric David Foronda | 2023-03-14 |
| 11594491 | Multi-die interconnect | Hong Bok We | 2023-02-28 |