Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Li-Sheng Weng, Ryan David Lane, Jianwen Xu, William Stone | 2023-10-10 |
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Ryan David Lane, Li-Sheng Weng, Eric David Foronda | 2023-03-14 |