Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Li-Sheng Weng, Charles David Paynter, Ryan David Lane, Jianwen Xu | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Li-Sheng Weng, Charles David Paynter, Ryan David Lane, Jianwen Xu | 2023-10-10 |