Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Cheng Xu, Liwei Cheng, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11764150 | Inductors for package substrates | Sri Chaitra Jyotsna Chavali, Tarek A. Ibrahim | 2023-09-19 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Yongki Min +1 more | 2023-02-14 |
| 11552019 | Substrate patch reconstitution options | Haifa Hariri, Amruthavalli Pallavi Alur, Islam A. Salama | 2023-01-10 |