Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830788 | Integrated circuits and methods for forming integrated circuits | Carl Naylor, Ashish Agrawal, Christopher J. Jezewski, Mauro J. Kobrinsky, Kevin Lin +1 more | 2023-11-28 |
| 11672133 | Vertically stacked memory elements with air gap | Aaron D. Lilak, Patrick Morrow, Hui Jae Yoo, Sean T. Ma, Scott B. Clendenning +2 more | 2023-06-06 |
| 11670588 | Selectable vias for back end of line interconnects | Christopher J. Jezewski, Ashish Agrawal, Kevin Lin, Abhishek A. Sharma, Carl Naylor | 2023-06-06 |
| 11594637 | Gate-all-around integrated circuit structures having fin stack isolation | Leonard P. GULER, Stephen D. Snyder, Biswajeet Guha, William Hsu, Tahir Ghani +4 more | 2023-02-28 |
| 11594485 | Local interconnect with air gap | Kevin Lin, Scott B. Clendenning, Tristan A. Tronic, Ehren Mannebach | 2023-02-28 |
| 11574910 | Device with air-gaps to reduce coupling capacitance and process for forming such | Abhishek A. Sharma, Willy Rachmady, Van H. Le, Travis W. Lajoie, Hui Jae Yoo +2 more | 2023-02-07 |
| 11569231 | Non-planar transistors with channel regions having varying widths | Stephen D. Snyder, Leonard P. GULER, Richard E. Schenker, Michael K. Harper, Sam Sivakumar +2 more | 2023-01-31 |