Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855125 | Capacitors with nanoislands on conductive plates | Srinivas V. Pietambaram, Brandon C. Marin, Jeremy Ecton, Hiroki Tanaka | 2023-12-26 |
| 11744480 | Catheter deflection system with deflection load limiter | Ryan Hoitink, Ricardo Padilla | 2023-09-05 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Praneeth Akkinepally | 2023-08-22 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li, Sameer Paital +4 more | 2023-08-15 |
| 11728077 | Magnetic material having coated ferromagnetic filler particles | Brandon C. Marin, Shivasubramanian Balasubramanian | 2023-08-15 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Praneeth Akkinepally, Jason M. Gamba, Robert Alan May | 2023-06-27 |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Praneeth Akkinepally, Dilan Seneviratne | 2023-02-07 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |