Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11808997 | Heterogeneous photonic integrated circuits with doped waveguides | Minh Tran, Tin Komljenovic | 2023-11-07 |
| 11762154 | Systems and methods for passively-aligned optical waveguide edge-coupling | Manan Raval, Matthew Sysak, Chen Li | 2023-09-19 |
| 11719883 | Integrated GaAs active devices with improved optical coupling to dielectric waveguides | Minh Tran, Tin Komljenovic, Hyun Dai Park | 2023-08-08 |
| 11721677 | Microelectronic assemblies having an integrated capacitor | Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-08-08 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu +2 more | 2023-07-18 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Ying Wang, Junnan Zhao, Cheng Xu, Yikang Deng | 2023-07-04 |
| 11646254 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Cheng Xu, Junnan Zhao | 2023-05-09 |
| 11640934 | Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate | Meizi Jiao, Hongxia Feng, Kevin Thomas McCarthy | 2023-05-02 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao | 2023-01-17 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Ying Wang | 2023-01-10 |