Issued Patents 2020
Showing 1–25 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879078 | Method of patterning resist layer and method of forming semiconductor structure using patterned resist layer | Chien-Wei Wang, Li-Po YANG | 2020-12-29 |
| 10872773 | Methods of reducing pattern roughness in semiconductor fabrication | Chien-Wei Wang, Joy Cheng, Chin-Hsiang Lin | 2020-12-22 |
| 10867839 | Patterning methods for semiconductor devices | Wei-Ren Wang, Shing-Chyang Pan, Wan-Lin Tsai, Jung-Hau Shiu, Tze-Liang Lee | 2020-12-15 |
| 10867794 | Patterning method for semiconductor devices and structures resulting therefrom | Jung-Hau Shiu, Szu-Ping Tung, Chun-Kai Chen, Jen Hung Wang, Tze-Liang Lee | 2020-12-15 |
| 10866517 | Lithography techniques for reducing resist swelling | Ming-Hui Weng, Cheng-Han Wu, Chin-Hsiang Lin | 2020-12-15 |
| 10866516 | Metal-compound-removing solvent and method in lithography | An-Ren Zi, Joy Cheng | 2020-12-15 |
| 10866511 | Extreme ultraviolet photolithography method with developer composition | An-Ren Zi, Joy Cheng, Chin-Hsiang Lin | 2020-12-15 |
| 10866515 | Lithography process using photoresist material with photosensitive functional group | Ming-Hui Weng, Cheng-Han Wu, Chin-Hsiang Lin, Siao-Shan Wang | 2020-12-15 |
| 10867922 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Hai-Ching Chen, Tien-I Bao | 2020-12-15 |
| 10863630 | Material composition and methods thereof | Siao-Shan Wang, Cheng-Han Wu, Chin-Hsiang Lin | 2020-12-08 |
| 10859915 | Adhesion layer for multi-layer photoresist | Chen-Yu Liu, Tzu-Yang Lin, Ya-Ching Chang, Chin-Hsiang Lin | 2020-12-08 |
| 10838304 | Priming material for organometallic resist | Chun-Chih HO, An-Ren Zi | 2020-11-17 |
| 10840066 | Adjustable fastening device for plasma gas injectors | Yung-Shun Hsu, Chiao-Kai Chang, Wai Hong Cheah, Chien-Fang Lin | 2020-11-17 |
| 10802402 | Material composition and process for substrate modification | Wei-Han Lai, Chien-Wei Wang, Chin-Hsiang Lin | 2020-10-13 |
| 10796910 | Method for performing a photolithography process | Tsung-Han Ko, Joy Cheng, Chin-Hsiang Lin | 2020-10-06 |
| 10777681 | Multi-layer photoresist | An-Ren Zi, Chin-Hsiang Lin | 2020-09-15 |
| 10768527 | Resist solvents for photolithography applications | Yu-Chung Su, Kuan-Hsin Lo, Yahru Cheng, Chin-Hsiang Lin | 2020-09-08 |
| 10770293 | Method for manufacturing a semiconductor device | Yu-Chung Su, Yahru Cheng | 2020-09-08 |
| 10755927 | Anti-reflective gap filling materials and methods | Yu-Chung Su | 2020-08-25 |
| 10747114 | Blocking layer material composition and methods thereof in semiconductor manufacturing | Siao-Shan Wang, Chen-Yu Liu, Chin-Hsiang Lin | 2020-08-18 |
| 10739673 | Preparing patterned neutral layers and structures prepared using the same | Kuan-Hsin Lo | 2020-08-11 |
| 10741410 | Material composition and methods thereof | An-Ren Zi, Joy Cheng | 2020-08-11 |
| 10741391 | Method for forming semiconductor structure by patterning resist layer having inorganic material | An-Ren Zi, Chin-Hsiang Lin | 2020-08-11 |
| 10727045 | Method for manufacturing a semiconductor device | Wan-Lin Tsai, Jung-Hau Shiu, Jen Hung Wang, Shing-Chyang Pan, Tze-Liang Lee | 2020-07-28 |
| 10698317 | Underlayer material for photoresist | An-Ren Zi, Wei-Han Lai | 2020-06-30 |