Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867922 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2020-12-15 |
| 10679846 | System and method of forming a porous low-K structure | Hai-Ching Chen, Tien-I Bao | 2020-06-09 |