| 10879210 |
Bonded structures |
Paul M. Enquist, Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram |
2020-12-29 |
| 10879207 |
Bonded structures |
Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram |
2020-12-29 |
| 10852545 |
Head mounted viewer for AR and VR scenes |
Ilyas Mohammed, Belgacem Haba |
2020-12-01 |
| 10849240 |
Contact structures with porous networks for solder connections, and methods of fabricating same |
Liang Wang, Hong Shen, Cyprian Emeka Uzoh |
2020-11-24 |
| 10847562 |
Image sensor device |
— |
2020-11-24 |
| 10818629 |
Tall and fine pitch interconnects |
Cyprian Emeka Uzoh |
2020-10-27 |
| 10802285 |
Remote optical engine for virtual reality or augmented reality headsets |
Belgacem Haba, Ilyas Mohammed |
2020-10-13 |
| 10790262 |
Low temperature bonded structures |
Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Guilian Gao, Laura Wills Mirkarimi |
2020-09-29 |
| 10784282 |
3D NAND—high aspect ratio strings and channels |
Xu Chang, Belgacem Haba |
2020-09-22 |
| 10658313 |
Selective recess |
Javier A. Delacruz, Shaowu Huang, Gaius Gillman Fountain, Jr., Liang Wang, Laura Wills Mirkarimi |
2020-05-19 |
| 10629577 |
Direct-bonded LED arrays and applications |
Min Tao, Liang Wang, Cyprian Emeka Uzoh |
2020-04-21 |
| 10629567 |
Multiple plated via arrays of different wire heights on same substrate |
Cyprian Emeka Uzoh |
2020-04-21 |
| 10593563 |
Fan-out wafer level package with resist vias |
Belgacem Haba, Ilyas Mohammed |
2020-03-17 |
| 10586759 |
Interconnection substrates for interconnection between circuit modules, and methods of manufacture |
Hong Shen, Liang Wang, Gabriel Z. Guevara, Cyprian Emeka Uzoh, Laura Wills Mirkarimi |
2020-03-10 |
| 10546832 |
Bonded structures |
Liang Wang, Javier A. Delacruz, Arkalgud R. Sitaram |
2020-01-28 |
| 10546834 |
Multi-chip modules formed using wafer-level processing of a reconstituted wafer |
Liang Wang |
2020-01-28 |
| 10531574 |
Contact structures with porous networks for solder connections, and methods of fabricating same |
Liang Wang, Hong Shen, Cyprian Emeka Uzoh |
2020-01-07 |
| 10529636 |
Fine pitch BVA using reconstituted wafer with area array accessible for testing |
— |
2020-01-07 |