| 10879155 |
Electronic device with double-sided cooling |
Woochan Kim, Vivek Kishorechand Arora |
2020-12-29 |
| 10861741 |
Electronic package for integrated circuits and related methods |
Kurt Peter Wachtler, Usman Mahmood Chaudhry |
2020-12-08 |
| 10763231 |
Bump bond structure for enhanced electromigration performance |
Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Makoto Yoshino +1 more |
2020-09-01 |
| 10763230 |
Integrated circuit backside metallization |
Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu +2 more |
2020-09-01 |
| 10748827 |
Packaged semiconductor devices for high voltage with die edge protection |
Woochan Kim, Vivek Kishorechand Arora |
2020-08-18 |
| 10734313 |
Integration of a passive component in an integrated circuit package |
Jeffrey Anthony Morroni, Rajeev Joshi, Sreenivasan K. Koduri, Sujan Kundapur Manohar, Yogesh Kumar Ramadass |
2020-08-04 |
| 10650957 |
Additive deposition low temperature curable magnetic interconnecting layer for power components integration |
Yi Yan, Luu Thanh Nguyen, Ashok S. Prabhu |
2020-05-12 |
| 10580722 |
High voltage flip-chip on lead (FOL) package |
Thomas D. Bonifield, Woochan Kim, Vivek Kishorechand Arora |
2020-03-03 |
| 10580715 |
Stress buffer layer in embedded package |
Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more |
2020-03-03 |
| 10573582 |
Semiconductor systems having dual leadframes |
Rajeev Joshi, Hau Nguyen, Ken Pham |
2020-02-25 |
| 10541220 |
Printed repassivation for wafer chip scale packaging |
Daiki Komatsu, Makoto Shibuya, Yi Yan, Hau Nguyen, Luu Thanh Nguyen |
2020-01-21 |