Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |