Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10848119 | Electronic component | Akihiko OIDE, Yoji Tozawa, Seiichi Nakagawa, Shinichi Kondo, Takashi Endo +1 more | 2020-11-24 |
| 10784834 | Lamination type LC filter array | Akihiko OIDE, Naoki Uchida, Yoji Tozawa, Seiichi Nakagawa, Shinichi Sato +2 more | 2020-09-22 |
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar +1 more | 2020-09-01 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2020-07-28 |
| 10665388 | Method of manufacturing laminated coil component | Yuya OSHIMA, Yoji Tozawa, Junichi Otsuka, Kazuo Iwai, Yohei TADAKI +3 more | 2020-05-26 |