Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861741 | Electronic package for integrated circuits and related methods | Anindya Poddar, Usman Mahmood Chaudhry | 2020-12-08 |
| 10861796 | Floating die package | Benjamin Stassen Cook, Steven Kummerl | 2020-12-08 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2020-07-28 |
| 10574184 | Stacked-die bulk acoustic wave oscillator package | Ricky Alan Jackson | 2020-02-25 |
| 10544039 | Methods for depositing a measured amount of a species in a sealed cavity | Benjamin Stassen Cook, Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs | 2020-01-28 |