Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861796 | Floating die package | Benjamin Stassen Cook, Kurt Peter Wachtler | 2020-12-08 |
| 10804185 | Integrated circuit chip with a vertical connector | Abram Castro | 2020-10-13 |
| 10553573 | Self-assembly of semiconductor die onto a leadframe using magnetic fields | Daniel Lee Revier, Benjamin Stassen Cook | 2020-02-04 |
| 10535594 | Interposer with extruded feed-through vias | — | 2020-01-14 |