Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879151 | Semiconductor package with liquid metal conductors | Dishit Paresh Parekh, Benjamin Stassen Cook, Jo Bito | 2020-12-29 |
| 10861715 | 3D printed semiconductor package | Benjamin Stassen Cook | 2020-12-08 |
| 10833648 | Acoustic management in integrated circuit using phononic bandgap structure | Benjamin Stassen Cook | 2020-11-10 |
| 10788367 | Integrated circuit using photonic bandgap structure | Benjamin Stassen Cook | 2020-09-29 |
| 10780467 | Methods and apparatus for surface wetting control | Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan | 2020-09-22 |
| 10622270 | Integrated circuit package with stress directing material | Benjamin Stassen Cook | 2020-04-14 |
| 10557754 | Spectrometry in integrated circuit using a photonic bandgap structure | Benjamin Stassen Cook | 2020-02-11 |
| 10553573 | Self-assembly of semiconductor die onto a leadframe using magnetic fields | Steven Kummerl, Benjamin Stassen Cook | 2020-02-04 |