Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804185 | Integrated circuit chip with a vertical connector | Steven Kummerl | 2020-10-13 |
| 10756013 | Packaged semiconductor system having unidirectional connections to discrete components | Saumya Gandhi, Matthew David Romig | 2020-08-25 |
| 10727085 | Printed adhesion deposition to mitigate integrated circuit package delamination | Yong Lin, Rongwei Zhang, Benjamin Stassen Cook | 2020-07-28 |
| 10566276 | Packaged semiconductor system having unidirectional connections to discrete components | Saumya Gandhi, Matthew David Romig | 2020-02-18 |