Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784188 | Methods and apparatus for a semiconductor device having bi-material die attach layer | Vikas Gupta | 2020-09-22 |
| 10727085 | Printed adhesion deposition to mitigate integrated circuit package delamination | Yong Lin, Benjamin Stassen Cook, Abram Castro | 2020-07-28 |
| 10559524 | 2-step die attach for reduced pedestal size of laminate component packages | Sadia Naseem, Vikas Gupta | 2020-02-11 |