Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784188 | Methods and apparatus for a semiconductor device having bi-material die attach layer | Rongwei Zhang | 2020-09-22 |
| 10559524 | 2-step die attach for reduced pedestal size of laminate component packages | Sadia Naseem, Rongwei Zhang | 2020-02-11 |