Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727085 | Printed adhesion deposition to mitigate integrated circuit package delamination | Rongwei Zhang, Benjamin Stassen Cook, Abram Castro | 2020-07-28 |
| 10636679 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Benjamin Stassen Cook | 2020-04-28 |