Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840179 | Electronic devices with bond pads formed on a molybdenum layer | Ricky Alan Jackson, Ting-Ta Yen | 2020-11-17 |
| 10723616 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2020-07-28 |
| 10680056 | IC with ion milled thin-film resistors | Bhaskar Srinivasan, Dhishan Kande | 2020-06-09 |
| 10651817 | Bulk acoustic wave resonator on a stress isolated platform | Ting-Ta Yen, Ricky Alan Jackson, Nicholas Stephen Dellas | 2020-05-12 |
| 10570006 | Infrared sensor design using an epoxy film as an infrared absorption layer | Ricky Alan Jackson, Walter B. Meinel, Kalin V. Lazarov | 2020-02-25 |
| 10526198 | Infrared sensor design using an epoxy film as an infrared absorption layer | Ricky Alan Jackson, Walter B. Meinel, Kalin V. Lazarov | 2020-01-07 |