| 10840179 |
Electronic devices with bond pads formed on a molybdenum layer |
Ricky Alan Jackson, Ting-Ta Yen |
2020-11-17 |
| 10723616 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more |
2020-07-28 |
| 10680056 |
IC with ion milled thin-film resistors |
Bhaskar Srinivasan, Dhishan Kande |
2020-06-09 |
| 10651817 |
Bulk acoustic wave resonator on a stress isolated platform |
Ting-Ta Yen, Ricky Alan Jackson, Nicholas Stephen Dellas |
2020-05-12 |
| 10570006 |
Infrared sensor design using an epoxy film as an infrared absorption layer |
Ricky Alan Jackson, Walter B. Meinel, Kalin V. Lazarov |
2020-02-25 |
| 10526198 |
Infrared sensor design using an epoxy film as an infrared absorption layer |
Ricky Alan Jackson, Walter B. Meinel, Kalin V. Lazarov |
2020-01-07 |