Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Ashok S. Prabhu, Anindya Poddar +2 more | 2020-09-01 |
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |
| 10650957 | Additive deposition low temperature curable magnetic interconnecting layer for power components integration | Yi Yan, Ashok S. Prabhu, Anindya Poddar | 2020-05-12 |
| 10541220 | Printed repassivation for wafer chip scale packaging | Daiki Komatsu, Makoto Shibuya, Yi Yan, Hau Nguyen, Anindya Poddar | 2020-01-21 |