Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763230 | Integrated circuit backside metallization | Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more | 2020-09-01 |
| 10665475 | Quad flat no lead package and method of making | Dan Okamoto | 2020-05-26 |
| 10658240 | Semiconductor die singulation | Shoichi Iriguchi, Genki Yano | 2020-05-19 |