Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more | 2020-09-01 |
| 10658240 | Semiconductor die singulation | Hiroyuki Sada, Genki Yano | 2020-05-19 |