Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763230 | Integrated circuit backside metallization | Hiroyuki Sada, Shoichi Iriguchi, Genki Yano, Luu Thanh Nguyen, Ashok S. Prabhu +2 more | 2020-09-01 |
| 10763231 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar +1 more | 2020-09-01 |
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Vivek Kishorechand Arora +1 more | 2020-03-03 |
| 10573582 | Semiconductor systems having dual leadframes | Rajeev Joshi, Anindya Poddar, Ken Pham | 2020-02-25 |
| 10541220 | Printed repassivation for wafer chip scale packaging | Daiki Komatsu, Makoto Shibuya, Yi Yan, Luu Thanh Nguyen, Anindya Poddar | 2020-01-21 |