Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879155 | Electronic device with double-sided cooling | Woochan Kim, Anindya Poddar | 2020-12-29 |
| 10748827 | Packaged semiconductor devices for high voltage with die edge protection | Woochan Kim, Anindya Poddar | 2020-08-18 |
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Kengo Aoya, Hau Nguyen +1 more | 2020-03-03 |
| 10580722 | High voltage flip-chip on lead (FOL) package | Anindya Poddar, Thomas D. Bonifield, Woochan Kim | 2020-03-03 |