Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2020-03-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Kengo Aoya, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2020-03-03 |