Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879144 | Semiconductor package with multilayer mold | Masamitsu Matsuura, Takeshi Onogami, Hideaki Matsunaga | 2020-12-29 |
| 10580715 | Stress buffer layer in embedded package | Woochan Kim, Masamitsu Matsuura, Mutsumi Masumoto, Hau Nguyen, Vivek Kishorechand Arora +1 more | 2020-03-03 |