Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636729 | Integrated circuit package with pre-wetted contact sidewall surfaces | Daiki Komatsu | 2020-04-28 |
| 10566269 | Low stress integrated circuit package | — | 2020-02-18 |
| 10541220 | Printed repassivation for wafer chip scale packaging | Daiki Komatsu, Yi Yan, Hau Nguyen, Luu Thanh Nguyen, Anindya Poddar | 2020-01-21 |