Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763231 | Bump bond structure for enhanced electromigration performance | Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763231 | Bump bond structure for enhanced electromigration performance | Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar, Makoto Yoshino +1 more | 2020-09-01 |