JL

Juntao Li

IBM: 85 patents #12 of 11,143Top 1%
Globalfoundries: 3 patents #135 of 837Top 20%
📍 Cohoes, NY: #1 of 31 inventorsTop 4%
🗺 New York: #8 of 13,137 inventorsTop 1%
Overall (2019): #86 of 560,194Top 1%
88
Patents 2019

Issued Patents 2019

Showing 76–88 of 88 patents

Patent #TitleCo-InventorsDate
10217707 Trench contact resistance reduction Zhenxing Bi, Kangguo Cheng, Peng Xu 2019-02-26
10217843 Fabrication of vertical field effect transistor structure with strained channels Kangguo Cheng 2019-02-26
10217841 Forming an uniform L-shaped inner spacer for a vertical transport fin field effect transistor (VT FinFET) Kangguo Cheng, Peng Xu, Jingyun Zhang 2019-02-26
10217658 Method and structure for minimizing fin reveal variation in FinFET transistor Zhenxing Bi, Kangguo Cheng, Hao Tang 2019-02-26
10211319 Stress retention in fins of fin field-effect transistors Sivananda K. Kanakasabapathy, Gauri Karve, Fee Li Lie, Stuart A. Sieg, John R. Sporre 2019-02-19
10211321 Stress retention in fins of fin field-effect transistors Sivananda K. Kanakasabapathy, Gauri Karve, Fee Li Lie, Stuart A. Sieg, John R. Sporre 2019-02-19
10204836 Porous silicon relaxation medium for dislocation free CMOS devices Kangguo Cheng, Ramachandra Divakaruni, Jeehwan Kim, Devendra K. Sadana 2019-02-12
10170364 Stress memorization technique for strain coupling enhancement in bulk finFET device Kangguo Cheng, Chun-Chen Yeh 2019-01-01
10170548 Integrated capacitors with nanosheet transistors Kangguo Cheng, James J. Demarest, John G. Gaudiello 2019-01-01
10170498 Strained CMOS on strain relaxation buffer substrate Kangguo Cheng, Balasubramanian Pranatharthiharan 2019-01-01
10168075 Critical dimension shrink through selective metal growth on metal hardmask sidewalls Hsueh-Chung Chen, Hong He, Chih-Chao Yang, Yunpeng Yin 2019-01-01
10170331 Stacked nanowires Zhenxing Bi, Kangguo Cheng, Xin Miao 2019-01-01
10170425 Microstructure of metal interconnect layer Hong He, Junli Wang, Chih-Chao Yang 2019-01-01