Issued Patents 2019
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453841 | Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction | Chia-Yu Chen, Bruce B. Doris, Rajasekhar Venigalla | 2019-10-22 |
| 10446670 | Integration of strained silicon germanium PFET device and silicon NFET device for FINFET structures | Bruce B. Doris, Junli Wang, Nicolas Loubet | 2019-10-15 |
| 10446650 | FinFET with a silicon germanium alloy channel and method of fabrication thereof | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2019-10-15 |
| 10418463 | Silicon germanium alloy fins with reduced defects | Kangguo Cheng, Juntao Li | 2019-09-17 |
| 10396185 | Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures | Bruce B. Doris, Nicolas Loubet, Junli Wang | 2019-08-27 |
| 10340368 | Fin formation in fin field effect transistors | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz, Yunpeng Yin | 2019-07-02 |
| 10319811 | Semiconductor device including fin having condensed channel region | Effendi Leobandung, Gen Tsutsui, Tenko Yamashita | 2019-06-11 |
| 10319816 | Silicon germanium fin channel formation | Nicolas Loubet, Junli Wang | 2019-06-11 |
| 10283418 | Method of forming silicon germanium and silicon fins on oxide from bulk wafer | James Kuss, Nicolas Loubet, Junli Wang | 2019-05-07 |
| 10243079 | Utilizing multilayer gate spacer to reduce erosion of semiconductor fin during spacer patterning | Andrew M. Greene, Sivananda K. Kanakasabapathy, Gauri Karve, Eric R. Miller, Pietro Montanini | 2019-03-26 |
| 10177167 | Hybrid substrate engineering in CMOS finFET integration for mobility improvement | Chia-Yu Chen, Bruce B. Doris, Rajasekhar Venigalla | 2019-01-08 |
| 10170471 | Bulk fin formation with vertical fin sidewall profile | Kangguo Cheng, Sivananda K. Kanakasabapathy, Chiahsun Tseng, Yunpeng Yin | 2019-01-01 |
| 10170425 | Microstructure of metal interconnect layer | Juntao Li, Junli Wang, Chih-Chao Yang | 2019-01-01 |
| 10170499 | FinFET device with abrupt junctions | Kangguo Cheng, Ali Khakifirooz, Alexander Reznicek, Soon-Cheon Seo | 2019-01-01 |
| 10170327 | Fin density control of multigate devices through sidewall image transfer processes | Chiahsun Tseng, Chun-Chen Yeh, Yunpeng Yin | 2019-01-01 |
| 10168075 | Critical dimension shrink through selective metal growth on metal hardmask sidewalls | Hsueh-Chung Chen, Juntao Li, Chih-Chao Yang, Yunpeng Yin | 2019-01-01 |