Issued Patents 2018
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9904776 | Fingerprint sensor pixel array and methods of forming same | Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen +2 more | 2018-02-27 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Tsung-Hsien Chiang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo +1 more | 2018-02-20 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2018-02-20 |
| 9881850 | Package structures and method of forming the same | Chen-Hua Yu, Chih-Hua Chen, Yu-Feng Chen | 2018-01-30 |
| 9875388 | Fingerprint sensor device and method | Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Chung-Shi Liu | 2018-01-23 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Chien Ling Hwang, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2018-01-16 |
| 9859235 | Underbump metallization structure | Yu-Wen Liu, Hsien-Wei Chen, Shin-Puu Jeng, Ying-Ju Chen, Shang-Yun Hou +2 more | 2018-01-02 |