Issued Patents 2018
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157789 | Via formation using sidewall image transfer process to define lateral dimension | Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Hosadurga Shobha +3 more | 2018-12-18 |
| 10103022 | Alternating hardmasks for tight-pitch line formation | John C. Arnold, Anuja E. DeSilva, Nelson Felix, Chi-Chun Liu, Stuart A. Sieg | 2018-10-16 |
| 10090164 | Hard masks for block patterning | Ekmini Anuja De Silva, Isabel C. Estrada-Raygoza, Indira Seshadri, Yongan Xu | 2018-10-02 |
| 10043744 | Avoiding gate metal via shorting to source or drain contacts | Victor Chan, Xuefeng Liu, Yongan Xu | 2018-08-07 |
| 10037922 | Co-integration of tensile silicon and compressive silicon germanium | Nicolas Loubet, Pierre Morin | 2018-07-31 |
| 10032632 | Selective gas etching for self-aligned pattern transfer | John C. Arnold, Sean D. Burns, Yongan Xu | 2018-07-24 |
| 10032633 | Image transfer using EUV lithographic structure and double patterning process | Hsueh-Chung Chen, Yongan Xu | 2018-07-24 |
| 10020255 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Hosadurga Shobha, Junli Wang, Yongan Xu | 2018-07-10 |
| 10020254 | Integration of super via structure in BEOL | Ruqiang Bao, Joe Lee, Hosadurga Shobha, Junli Wang, Yongan Xu | 2018-07-10 |
| 9984919 | Inverted damascene interconnect structures | Xunyuan Zhang, Chanro Park, Yongan Xu, Peng Xu | 2018-05-29 |
| 9916986 | Single or mutli block mask management for spacer height and defect reduction for BEOL | Benjamin D. Briggs, Lawrence A. Clevenger | 2018-03-13 |
| 9905478 | Co-integration of tensile silicon and compressive silicon germanium | Nicolas Loubet, Pierre Morin | 2018-02-27 |
| 9859426 | Semiconductor device including optimized elastic strain buffer | Nicolas Loubet, Pierre Morin | 2018-01-02 |