| 10121688 |
Electrostatic chuck with external flow adjustments for improved temperature distribution |
Matthew J. Busche, Wendell Glenn Boyd, Jr., Senh Thach, Konstantin Makhratchev, Masanori Ono |
2018-11-06 |
| 10079165 |
Electrostatic chuck with independent zone cooling and reduced crosstalk |
Konstantin Makhratchev |
2018-09-18 |
| 10056284 |
Electrostatic chuck optimized for refurbishment |
Kadthala Ramaya Narendrnath |
2018-08-21 |
| 10053778 |
Cooling pedestal with coating of diamond-like carbon |
Kurt J. Ahmann, Matthew Tsai, Steve Sansoni |
2018-08-21 |
| 10020218 |
Substrate support assembly with deposited surface features |
Wendell Glenn Boyd, Jr., Teng-Fang Kuo, Zhenwen Ding |
2018-07-10 |
| 10008399 |
Electrostatic puck assembly with metal bonded backing plate for high temperature processes |
— |
2018-06-26 |
| 10008404 |
Electrostatic chuck assembly for high temperature processes |
— |
2018-06-26 |
| 9991148 |
Electrostatic chuck having thermally isolated zones with minimal crosstalk |
Konstantin Makhratchev, Jason C. Della Rosa, Hamid Noorbakhsh, Brad L. Mays, Douglas A. Buchberger, Jr. |
2018-06-05 |
| 9986598 |
Temperature control apparatus including groove-routed optical fiber heating, substrate temperature control systems, electronic device processing systems, and processing methods |
Matthew J. Busche, Wendell Glenn Boyd, Jr., Dmitry A. Dzilno, Michael R. Rice, Leon Volfovski |
2018-05-29 |
| 9984911 |
Electrostatic chuck design for high temperature RF applications |
Ryan Edwin Hanson, Manjunatha Koppa, John C. Forster, Keith A. Miller |
2018-05-29 |
| 9969022 |
Vacuum process chamber component and methods of making |
— |
2018-05-15 |
| 9887121 |
Protective cover for electrostatic chuck |
— |
2018-02-06 |
| 9875923 |
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods |
Wendell Glenn Boyd, Jr., Matthew J. Busche, Konstantin Makhratchev, Masanori Ono, Senh Thach |
2018-01-23 |
| 9865489 |
Substrate support chuck cooling for deposition chamber |
Brian T. West, Robert T. Hirahara, Dan DEYO |
2018-01-09 |
