Issued Patents 2017
Showing 101–109 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2017-01-31 |
| 9553070 | 3D packages and methods for forming the same | Der-Chyang Yeh | 2017-01-24 |
| 9553000 | Interconnect structure for wafer level package | Jing-Cheng Lin, Nai-Wei Liu, Jui-Pin Hung, Shin-Puu Jeng | 2017-01-24 |
| 9548274 | Reticle for non-rectangular die | Ming-Fa Chen, Sung-Feng Yeh | 2017-01-17 |
| 9543170 | Semiconductor packages and methods of forming the same | Jing-Cheng Lin, Po-Hao Tsai | 2017-01-10 |
| 9536811 | Semiconductor die contact structure and method | Chung-Shi Liu | 2017-01-03 |
| 9537205 | 3D antenna for integrated circuits | Jeng-Shieh Hsieh, Chung-Hao Tsai, Chuei-Tang Wang | 2017-01-03 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Chen-Shien Chen, Yu-Jen Tseng | 2017-01-03 |
| 9536818 | Semiconductor package and method of forming the same | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2017-01-03 |