Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806055 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Ming-Fa Chen | 2017-10-31 |
| 9754918 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai | 2017-09-05 |
| 9741694 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Ming-Fa Chen | 2017-08-22 |
| 9620488 | Three-dimensional integrated circuit structure and bonded structure | Chen-Hua Yu, Ming-Fa Chen | 2017-04-11 |
| 9548274 | Reticle for non-rectangular die | Chen-Hua Yu, Ming-Fa Chen | 2017-01-17 |