Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754918 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh | 2017-09-05 |
| 9711379 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen | 2017-07-18 |
| 9698081 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Ming-Fa Chen | 2017-07-04 |
| 9666520 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou | 2017-05-30 |
| 9633917 | Three dimensional integrated circuit structure and method of manufacturing the same | Ming-Fa Chen, Chen-Hua Yu | 2017-04-25 |
| 9613926 | Wafer to wafer bonding process and structures | Chen-Hua Yu, Ming-Fa Chen | 2017-04-04 |